SK Hynix has witnessed a massive surge in 12-layer HBM3E demand, prompting the firm to rapidly upscale production and yield rates.
SK Hynix’s 12-layer HBM3E Is In Massive Demand From The AI Markets, Prompting The Firm To Rapidly Enhance The Supply Chain
SK Hynix has been at the forefront of supplying HBM to cater to the demand from the industry. In terms of the market competition out there, SK Hynix has dominated by far when it comes to both process superiority and production capacities. Now, according to a new report by BusinessKorea, SK Hynix is set to further enhance the production of its 12-layer HBM3E production by integrating a 3D inspection equipment unit, to avoid defects associated with HBM production.
SK Hynix is reportedly facing massive demand for 12-layer HBM3E production, specifically from the likes of NVIDIA, which is why the firm has decided to introduce additional checks to ensure a thorough production.
It is said that SK Hynix is seeing a hindrance in the wafer-to-chip cutting process since the process is prone to unnecessary damage with the addition of four more layers. However, by incorporating 3D inspection units, the memory manufacturer plans on significantly upscaling yield rates and production capacities.
SK Hynix is receiving requests from major HBM customers like NVIDIA to supply 12-layer products faster and in larger quantities. If the evaluation is completed, there is a high possibility that Nextin’s equipment will be introduced into the 12-layer mass production line.
– Industry Insider via BusinessKorea
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