NVIDIA CEO Says Blackwell “Design Flaws” Were 100% On The Company, TSMC Had No Part To Play & Now Back To Full Production

NVIDIA says that Blackwell’s design flaws are 100% on them, saying that TSMC had no part to play and that the Taiwan giant sorted the issue out.

NVIDIA Verifies That The Firm Indeed Witnessed Blackwell Design Flaws; However, The Issue Was Rectified At An “Incredible Pace”

Team Green’s Blackwell AI portfolio is one of the most in-demand products in the industry, mainly due to the performance and capabilities it brings onboard. However, a few weeks prior to launch, it was rumored that the architecture had become a victim of design flaws, with the culprit being the packaging technology onboard, and the problem was associated with TSMC’s CoWoS, creating the perception that the Taiwan giant was behind NVIDIA’s Blackwell flaws.

However, in a report by Reuters, NVIDIA’s CEO Jensen Huang has verified that Blackwell was indeed encountered with design flaws, but interestingly, TSMC had no part to play in it, and instead, it was “100% NVIDIA’s fault”. Here is what he had to say:

We had a design flaw in Blackwell. It was functional, but the design flaw caused the yield to be low. It was 100% Nvidia’s fault. In order to make a Blackwell computer work, seven different types of chips were designed from scratch and had to be ramped into production simultaneously.

What TSMC did, was to help us recover from that yield difficulty and resume the manufacturing of Blackwell at an incredible pace.

– NVIDIA’s CEO via Reuters

Well, it looks like NVIDIA has resorted to fixing…